JVCC EGPF-01 Kapton™ Polyimide Film Tape is a 1 mil electrical grade Kapton alternative POLYIMIDE film coated with a high-performance silicone adhesive. It is a wave solder/hot air leveling tape used to protect gold contacts on printed circuit boards from molten solder during hot air wave solder leveling process. It also can be used for bicycle rims.
It is thin and conformable, with outstanding tear and abrasion resistance at elevated temperatures. Adhesive will thermoset to increase adhesion values. Leaves minimal residue when removed after the manufacturing process; reduces clean-up time and minimizes rejects.
Permits observation of board during processing. EGPF-01 Kapton Electrical Grade/Printed Circuit Polyimide Film Tape has excellent resistance to acids, oils, solvents, aging, staining, and water immersion.
Standards Met: MIL-P-46112B; UL510 approved for flame retardance. Carrier/Backing: electrical grade polyimide film.
Adhesive: high-performance silicone. Thickness: 2.6 mils (carrier, adhesive) 1 mils (carrier). Adhesion: 21 ounces per inch (to stainless steel test panel). Tensile Strength: 21 pounds per inch (longitudinal). Dielectric Breakdown: 6500 volts. Service/Operating Temperature: 14F to 392F. Elongation: 40%. Core: 3-inch diameter plastic.